The HP100-SE Hot Plates are compact bench-top precision heating systems with electronic lift pins for proximity baking. The advanced control system allows the heating temperature up to 300°C with the precision of 0.5°C.
HP100-SE Hot Plate Specifications
- Temperature range: RT – 300°C
- Electronics lift pins height range: 0 – 30.0mm
- 7-inch touchscreen with graphic user interface
- Substrate sizes: pieces (<1cm) to 200mm round
- Durable stainless-steel construction
- Program: 100 recipes available on board
- Heating time and lift pins height are adjustable.
- Hot Plate Size: 220mm x 220mm
- Electronic lift pins height resolution: 0.1mm
- Remote control panel for easy access (HP100-SR)
- Electronic lift pins for substrate sizes > 40mm
- Anodized aluminium heating plate.
- 5 heating stage for each recipe.
- Weight: 25kg
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