Rapid Thermal Processing refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1,200 °C or greater) on a timescale of several seconds or less.

During cooling, however, wafer temperatures must be brought down slowly so they do not break due to thermal shock. Such rapid heating rates are often attained by high intensity lamps or lasers. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.

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