A die bonder is a mechanism that attaches a semiconductor device to the next level of connectivity, such as a substrate or a board. Although the goal is the same, die bonding procedures and equipment vary widely depending on functionality, cost, performance, size, hermeticity, product life expectancy, and needed dependability.
Die bonding is a manufacturing procedure used in semiconductor packaging. It is the process of connecting a die (or chip) to a substrate or packaging using epoxy or solder. It is also known as die placement or die attach. The procedure begins with selecting a die from a wafer or waffle pack and positioning it on the substrate. The die is inserted into a previously dispensed epoxy or solder.
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